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 JIANGYIN, China, April 4, 2023 — The SJ Semiconductor Company (“SJSemi”) has closed a USD 340 million C+ financing deal with seasoned investors. US dollar fundraising has been closed. However, RMB funding will be closed after the applicable ODI (outbound direct investment) regulatory processes have been completed. Legend Capital, Goldstone Investment, Jade Stone Venture, Shang Qi Capital, Leafoison Capital, TCL Capital, China Fortune-innovation Capital, and GLP-C&D Capital are some investors participating. Oriza Rivertown and Oriza Hua Capital are two existing shareholders that increased their stake. The company will remain open to receiving further US dollar capital. The company’s valuation will be close to USD 2 billion after the Series C+ fundraising is completed and more than USD 1 billion in total capital has been obtained.

SJSemi invented the 12-inch MEOL (Middle-End-Of-Line) foundry in China. It is highly renowned for its 12-inch high-density bumping, testing, and WLCSP (wafer-level chip scale package) services and for working with top IC manufacturers nationally and abroad. SJSemi is now able to provide high performance advanced packaging based on silicon interposers, fan-out wafer, and substrates to meet the growing demand in markets like smart phones, networking, data centers, artificial intelligence, and the automotive industry by utilizing bumping and RDL technologies and leveraging its advantage of front-end fab management and quality system.

SJSemi increased the resilience of its supply chain in 2022, and by expanding the domestic market and solidifying its overseas business, it saw a 17% increase in annual revenue. SJSemi has maintained significant capacity growth and R&D expenditure in recent years, which helps with market share and new business prospects. Beyond expectations, the Series C+ first signing will increase the company’s overall technological strength in advanced high-performance packaging.

In August 2014, SJ Semiconductor Company was incorporated and registered. SJSemi promises to provide first-rate Middle-End-Of-Line (MEOL) production and testing services and create cutting-edge 3D Multi-Die Integration technology and solutions, starting with the sophisticated 12-inch bumping and RDL. It is dedicated to offering a simple one-stop service to provide premium chips for both domestic and foreign consumers and to support the improvement of their level of global competitiveness.

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Kshitij does business research and content writing for VCBay. Pursuing BBA from Symbiosis Center Of Management Studies (SCMS) Pune, he is skilled in Financial Modeling, Stock valuation and Microsoft Excel. He is passionate about Entrepreneurship and Finance.

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